SESHA 2003 Symposium - Abstract

Can 300 mm Wet Tools Meet ITRS Water USe Goals?

Chiarello, Dr. , Ron
(Jetalon, San Fransciso CA)

In a typical semiconductor fab as much as 95% of ultrapure water (UPW) is consumed in chemical mechanical polishing (CMP) and wafer surface preparation. The International Technology Roadmap for Semiconductors (ITRS) has set aggressive goals for reducing UPW consumption through 2006. An obvious solution to help meet ITRS goals is to reduce point-of-use UPW consumed by CMP and surface prep tools. In this paper, UPW use, waste water concerns and effective optimization strategies for 300 mm wet tools are described. The results show that ITRS goals can be realized if UPW optimization strategies are implemented

[abstract as .pdf]