SESHA 2005 Symposium - Abstract

Chemical Vapor Deposition Process Emission Reduction Using Point-Of-Use Wet Scrubber Technology

Kempton, Curtis*; Jain, Anita
(Rogers, Chandler, AZ)

A chemical vapor deposition process (using silicon tetrachloride and titanium tetrachloride) exhausted to a conventional end-of-pipe wet grid scrubber failed emissions testing for HCl removal efficiency (< 90%), as well as particulate emission requirements of Maricopa County Air Pollution Control Regulation III, Rule 311. In addition, exhaust ducts were fouled quickly with deposited residues. A path to resolve the problem was being pursued with conventional end-of-pipe control technology. In this case a wet scrubber followed by a wet electrostatic precipitator had been recommended. Even with this technology, there was no guarantee of meeting the requirements. Additional research lead to the evaluation and use of point-of-use (POU) wet scrubber technology followed by the existing end-of-pipe wet grid scrubber. Following pilot testing, POU wet scrubbers were added to the process and the follow-up system tests demonstrated HCl removal efficiency of 99.6% and compliance with particulate emission requirements of Maricopa County Rule 311. In addition, other benefits of implementing the POU wet scrubber technology were realized.

[abstract as .pdf]